Daniel F Sunday

Title: The Innovations of Daniel F Sunday

Introduction

Daniel F Sunday is an accomplished inventor based in Gaithersburg, MD (US). He has made significant contributions to the field of semiconductor devices, particularly in the characterization of high aspect ratio structures. His innovative work has led to the development of methods that enhance the understanding of these complex structures.

Latest Patents

Daniel F Sunday holds a patent titled "Determining tilt angle in patterned arrays of high aspect-ratio structures by small-angle x-ray scattering." This patent provides methods and apparatus for characterizing high aspect ratio (HAR) structures in semiconductor devices. The techniques involve using small angle X-ray scattering (SAXS) to determine average parameters of an array of HAR structures. The analysis includes parameters such as tilt, sidewall angle, bowing, and the presence of multiple tilts in HAR structures.

Career Highlights

Throughout his career, Daniel has worked with notable organizations, including Lam Research Corporation and the Government of the United States of America, as represented by the Secretary of Commerce. His expertise in semiconductor technology has positioned him as a valuable asset in the industry.

Collaborations

Daniel has collaborated with esteemed colleagues such as William Dean Thompson and Regis Joseph Kline. These partnerships have contributed to the advancement of research and innovation in the field of semiconductor devices.

Conclusion

Daniel F Sunday is a prominent inventor whose work in semiconductor technology has led to significant advancements in the characterization of high aspect ratio structures. His contributions continue to influence the industry and pave the way for future innovations.