Company Filing History:
Years Active: 1990
Title: Innovations of Daniel E. Bullock in EMI Shielding
Introduction
Daniel E. Bullock, an accomplished inventor located in Attleboro, Massachusetts, is known for his significant contributions to the field of electromagnetic interference (EMI) shielding. With a focus on innovative materials and processes, Bullock has secured a patent that demonstrates his expertise in creating effective shielding solutions.
Latest Patents
Bullock's most notable patent is titled "Fiber reinforced polymeric structure for EMI shielding and process for." This invention involves a fiber-reinforced plastic structure composed of a matrix of thermoplastic material in combination with conductive fibers. This unique design provides effective EMI shielding while allowing for the use of relatively long conductive fibers. The approach minimizes the fiber loading required, enhancing the efficiency of the shielding capabilities.
Career Highlights
Throughout his career, Daniel E. Bullock has been associated with General Electric Company, a leading organization recognized for its innovative technologies. His role has been instrumental in advancing research and development initiatives within the company, particularly in the area of EMI shielding solutions.
Collaborations
Bullock has worked alongside esteemed colleagues such as Horold F. Giles, Jr. and Walter L. Hall, contributing to the continuous development of innovative materials and technologies within the industry. These collaborations have played an essential role in bringing forward groundbreaking solutions that address complex engineering challenges.
Conclusion
Daniel E. Bullock's work exemplifies the spirit of innovation in modern engineering. His patent for a fiber-reinforced polymeric structure for EMI shielding not only highlights his inventiveness but also his commitment to developing effective solutions that meet contemporary technological needs. As he continues to work within General Electric Company, his future contributions are anticipated to pave the way for further advancements in EMI shielding technologies.