This inventor holds 1 USPTO granted patent. Top assignee: Ormet Corporation. Active years: 2000.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2000
Title: The Innovative Contributions of Daniel E Baxter
Introduction
Daniel E Baxter is a notable inventor based in Leucadia, California. He has made significant contributions to the field of electronics packaging through his innovative methods. With a focus on producing insulated conductive through-features, Baxter's work has implications for the development of advanced electronic devices.
Latest Patents
Baxter holds a patent for "Methods to produce insulated conductive through-features in core." This invention discloses methods for the production of insulated, conductive through-features in conductive core materials specifically designed for electronics packaging. The methods utilize protective mask technology to facilitate the selective removal of material from planar conductive core material that has been encapsulated in electrically insulated materials. By filling the cavity in the conductive core material with an electrically insulated material, the through-feature is electrically isolated from the remainder of the core material. This process results in a conductive through-feature that completely transverses the core of the substrate board. Additionally, the invention provides planar substrates for multilayer printed circuit boards or chip carriers, which comprise the conductive through-features produced by these methods.
Career Highlights
Baxter is currently associated with Ormet Corporation, where he continues to innovate in the field of electronics. His work has garnered attention for its potential to enhance the performance and reliability of electronic devices.
Collaborations
Baxter has collaborated with notable colleagues such as Pradeep R Gandhi and Samuel Fu. Their combined expertise contributes to the advancement of technology in their field.
Conclusion
Daniel E Baxter's innovative methods for producing insulated conductive through-features represent a significant advancement in electronics packaging. His contributions continue to influence the development of modern electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile