Location History:
- Hockessin, DE (US) (1995)
- Yorklyn, DE (US) (1983 - 1999)
Company Filing History:
Years Active: 1983-1999
Title: The Innovative Contributions of Daniel D Johnson
Introduction
Daniel D Johnson is a notable inventor based in Yorklyn, Delaware. He has made significant contributions to the field of technology, holding a total of 10 patents. His work primarily focuses on advanced materials and electronic components, showcasing his expertise and innovative spirit.
Latest Patents
Among his latest patents, the "Metallurgical Interconnect Composite" stands out. This invention features a compliant, metallurgical, open cell, porous substrate with a multitude of Z-axis conductive pathways. These pathways extend from one side of the substrate to the other, terminating in a solder-covered surface area. Another significant patent is the "Faraday Cage," designed for EMI/RFI shielding. This invention includes a substrate with an electrical ground, at least one electronic component connected to the substrate, a conductive housing, and an electrically conductive adhesive. The adhesive is characterized by a substrate with numerous passageways, which are filled with a non-conductive adhesive resin, effectively shielding against electromagnetic and radio frequency interference.
Career Highlights
Daniel has worked with prominent companies such as W. L. Gore & Associates, Inc. and E.I. du Pont de Nemours and Company. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.
Collaborations
Throughout his career, Daniel has collaborated with talented individuals, including Herbert L Fritz and David Robert King. These partnerships have fostered a creative environment that has led to the development of groundbreaking inventions.
Conclusion
Daniel D Johnson's contributions to the field of technology through his patents and collaborations highlight his role as an influential inventor. His innovative spirit continues to inspire advancements in materials and electronic components.