E.i. Dupont De Nemours and Company

W. L. Gore & Associates, Inc.

Daniel D Johnson

Herbert L Fritz

Joseph G Ameen

Bradley E Reis

Donald R Banks

James R Hanrahan

David Robert King

Carmine G Meola

Joseph C Rowan

Yvan P Pilette

A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of the substrate to the other side. Each conductive pathway terminates in a solder covered surface area.

Metallurgical interconnect composite

A Faraday cage is provided for EMI/RFI shielding which includes a substrate having an electrical ground; at least one electronic component electrically connected to the substrate; a conductive housing; and an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways are filled with a non-conductive adhesive resin. The conductive housing is adhesively electrically mounted to the electrical ground of the substrate, over the electronic component, to shield electromagnetic and radio frequency interference.

Faraday cage

An electrical interconnect is described which is a structure comprising a polymer matrix of a microstructure of nodes separated by void spaces and being interconnected by fibrils. The nodes are generally aligned elongated columns and have conductive particles embedded in them. The void spaces may be filled with a nonconductive adhesive.

Electrical conductive polymer matrix

A conductive through-hole hole is formed by through a dielectric sandwiched between conductors forming a noncircular hole in a conductor, etching a hole through the dielectric and by deforming at the conductor which has been undercut during the etching.

Article containing conductive through-holes

Dielectric materials having low dielectric constant are provided, the materials comprising fabrics impregnated with thermosetting resins, at least a portion of the fibers in the fabrics being fluorocarbon fibers. Also provided is a method of manufacture of these dielectric materials. The dielectric materials are useful in the fabrication of multilayer printed circuit boards.

Dielectric materials

A conductive through-hole hole is formed through a dielectric sandwiched between conductors by forming a noncircular hole in a conductor, etching a hole through the dielectric and by deforming at the conductor which has been undercut during the etching.

Process for forming conductive through-holes through a dielectric layer

A conductive through-hole hole is formed by liquid chemically etching a hole completely through a dielectric sandwiched between conductors and by deforming at least one conductor which has been undercut during the etching.

Liquid chemical process for forming conductive through-holes through a

A conductive through-hole is formed by plasma etching a hole completely through a dielectric sandwiched between conductors and by deforming at least one conductor which has been undercut during the etching.

Process using plasma for forming conductive through-holes through a

An integrated process for laminating a continuous layer of photosensitive composition to the surface of each member of a series of substrate elements and automatically trimming the layer from the leading and trailing edges of the laminated substrate elements.

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Yorklyn, DE, United States of America

Daniel D Johnson