This inventor holds 1 USPTO granted patent. Top assignee: Si Diamond Technology, Inc.. Active years: 2003.
Company Filing History:
Years Active: 2003
Title: Daniel Bruce Bullock: Innovator in Glass BGA Technology
Introduction
Daniel Bruce Bullock is an accomplished inventor based in Austin, TX. He is known for his innovative contributions to the field of electronics packaging, particularly in the development of glass ball grid array (BGA) technology. His work has significantly impacted the way electronic components are integrated into devices.
Latest Patents
Daniel holds a patent for a glass BGA package. This invention provides a glass substrate that includes a plurality of conductive leads, such as thin film metal deposited thereon. A die or chip is mounted in a fixed relationship to the glass substrate, often directly on it. The die features multiple I/O pads that allow for electrical access to the circuitry inside. Additionally, the circuitry connects the I/O pads to the conductive leads on the glass substrate, enhancing the functionality and reliability of electronic devices.
Career Highlights
Daniel is currently employed at Si Diamond Technology, Inc., where he continues to innovate in the field of electronic packaging. His work at the company has positioned him as a key player in advancing BGA technology, which is crucial for modern electronics.
Collaborations
Daniel has collaborated with notable colleagues, including Zvi Yaniv and Curtis Nathan Potter. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Daniel Bruce Bullock is a significant figure in the realm of electronic packaging, with his patent for a glass BGA package showcasing his innovative spirit. His contributions continue to influence the industry and pave the way for future advancements.