Dublin, OH, United States of America

Daniel Benedum

This inventor holds 1 USPTO granted patent. Top assignee: Mettler-Toledo Gmbh. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel Benedum. Retrieved from https://idiyas.com/inventor/daniel-benedum

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Daniel Benedum: Inventor in Weighing Technology

Introduction

Daniel Benedum is an inventor based in Dublin, Ohio, whose patent work concerns weight measurement and accuracy indications for scales. His disclosed invention addresses how scale systems can communicate the estimated accuracy of a weighment to users.

Latest Patents

Benedum is associated with 1 patent: “Methods for Providing Weight Accuracy Indications for Scales, Systems, and Apparatus for the Same.” The invention describes a controller that receives load data from one or more scale sensors and determines a weight reading. It estimates the weighment’s error magnitude using load data, additional data, or both, then displays the weight reading alongside information based on that estimated error. The method is applicable to scales such as vehicle scales.

Career Highlights

Benedum is associated with Mettler-Toledo GmbH, a company working in measurement and weighing technologies. His patent reflects an approach to making scale readings more informative by presenting users with an indication of estimated measurement accuracy.

Collaborations

Benedum’s listed coworkers include Eric V. Wechselberger and Jessica Ferree. The available information identifies them as coworkers but does not specify their roles in the patent.

Conclusion

Daniel Benedum’s patent focuses on pairing scale readings with estimated error information, helping users better understand the accuracy of weighments.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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