Valparaiso, IN, United States of America

Daniel A Smith

This inventor holds 2 USPTO granted patents. Top assignee: Gate Pallet Systems, Inc.. Active years: 1991-1992.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel A Smith. Retrieved from https://idiyas.com/inventor/daniel-a-smith-ce64khfy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 2

Forward Citations = 31(Granted Patents)


Company Filing History:


Years Active: 1991-1992

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2 patents (USPTO):Explore Patents

Title: The Innovations of Daniel A. Smith

Introduction

Daniel A. Smith is an accomplished inventor based in Valparaiso, IN (US). He has made significant contributions to the field of pallet assembly with his innovative designs. With a total of 2 patents to his name, Smith continues to push the boundaries of manufacturing technology.

Latest Patents

Smith's latest patents include a "Method for Manufacturing Pallet Assembly" and a "Corrugated Construction Pallet Assembly." The first patent describes a disposable pallet assembly that incorporates cylindrical reinforcing pieces engaged with the stringer members along the bottom side portions. The second patent also focuses on a similar disposable pallet assembly, emphasizing the use of cylindrical reinforcing pieces for enhanced structural integrity.

Career Highlights

Daniel A. Smith is currently associated with Gate Pallet Systems, Inc., where he applies his expertise in developing innovative pallet solutions. His work has been instrumental in improving the efficiency and sustainability of pallet manufacturing processes.

Conclusion

Daniel A. Smith's contributions to the field of pallet assembly demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of manufacturing needs and a drive to create practical solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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