Daniel A Huang

Title: The Innovative Contributions of Daniel A. Huang

Introduction

Daniel A. Huang is a notable inventor based in West Hills, California. He has made significant contributions to the field of electronic device packaging, holding a total of 4 patents. His work has advanced the technology used in circuit assemblies and chip-on-board electronic devices.

Latest Patents

One of his latest patents is titled "Chip scale packaging on CTE matched printed wiring boards." This invention involves a circuit assembly that includes a heat sink assembly and a chip scale package assembly. The chip scale package assembly features an integrated circuit die coupled to a first printed wiring board, while the heat sink assembly has an integrated circuit die coupled to a second printed wiring board. The design allows for separate assembly of the heat sink and chip scale package, ensuring that the circuit pads on both printed wiring boards correspond and can be connected through solder or adhesive bonding. Another significant patent is "Preparation of passivated chip-on-board electronic devices." This invention describes a chip-on-board electronic device that includes an electronic device die affixed to a printed circuit board, interconnected by wirebonds. The device is protected by a layer of silicon oxynitride, with the option of an additional conformal coating.

Career Highlights

Daniel has worked with prominent companies such as Hughes Electronics Corporation and The Boeing Company. His experience in these organizations has contributed to his expertise in electronic device technology and innovation.

Collaborations

Throughout his career, Daniel has collaborated with notable colleagues, including Ching P. Lo and Richard Fanucchi. These collaborations have likely enriched his work and led to further advancements in his field.

Conclusion

Daniel A. Huang's contributions to electronic device packaging and circuit assembly have made a significant impact in the industry. His innovative patents and collaborations reflect his dedication to advancing technology in this field.