Shanghai, China

Danfeng Li

This inventor holds 2 USPTO granted patents and 3 published patent applications and 3 EPO patents. Top assignee: Bostik Sa. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Danfeng Li. Retrieved from https://idiyas.com/inventor/danfeng-li-qqlvezmu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 50.0

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2025-2026

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Danfeng Li

Introduction

Danfeng Li is a notable inventor based in Shanghai, China. He has made significant contributions to the field of adhesive technology. His work focuses on developing innovative solutions that enhance the performance and application of adhesives in various industries.

Latest Patents

Danfeng Li holds 1 patent for his invention titled "Low tack hot-melt pressure sensitive adhesives." This invention relates to a hot-melt pressure sensitive adhesive composition that includes at least one styrenic block copolymer, at least one tackifying resin, at least one mineral oil, and a specific percentage of waxes. The composition is designed to improve the effectiveness and usability of pressure-sensitive adhesives in various applications.

Career Highlights

Danfeng Li is currently employed at Bostik SA, a company known for its expertise in adhesive solutions. His role at Bostik allows him to apply his innovative ideas and contribute to the development of advanced adhesive products. His work has positioned him as a key player in the adhesive technology sector.

Collaborations

Danfeng Li has collaborated with talented coworkers, including Xin Ye and Peipei He. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge adhesive technologies.

Conclusion

Danfeng Li's contributions to adhesive technology through his innovative patent demonstrate his commitment to advancing the field. His work at Bostik SA and collaborations with colleagues further enhance the impact of his inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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