Nanjing, China

Dandan Yan

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Nanjing University of Aeronautics and Astronautics. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dandan Yan. Retrieved from https://idiyas.com/inventor/dandan-yan-yflcmrzo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Dandan Yan: Innovator in Sand Mold Technology

Introduction

Dandan Yan is a prominent inventor based in Nanjing, China. She has made significant contributions to the field of sand mold technology, particularly through her innovative methods that enhance the efficiency and environmental sustainability of mold preparation.

Latest Patents

Dandan Yan holds a patent for a "Method for preparing negative pressure film-covering frozen sand mold." This method involves obtaining a mold cavity through numerically controlled machining of a frozen sand blank. It includes covering the mold cavity with a softened thin film and sealing it with a back film to create an integral sand mold. The process is designed to be environmentally friendly, resulting in a high-strength frozen sand mold that is convenient for sand cleaning.

Career Highlights

Dandan Yan is affiliated with Nanjing University of Aeronautics and Astronautics, where she continues to advance her research and development in innovative mold technologies. Her work has garnered attention for its practical applications in the manufacturing and casting industries.

Collaborations

Dandan collaborates with notable colleagues, including Haoqin Yang and Zhongde Shan, who contribute to her research efforts and innovations in the field.

Conclusion

Dandan Yan's contributions to sand mold technology exemplify her commitment to innovation and sustainability. Her patented methods not only improve manufacturing processes but also promote environmental responsibility.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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