Wageningen, Netherlands

Dandan Liu

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Paqell B.v.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dandan Liu. Retrieved from https://idiyas.com/inventor/dandan-liu-19jezcu4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Dandan Liu and Carbon Dioxide Conversion

Introduction

Dandan Liu is an inventor associated with Wageningen, the Netherlands. Her patent work concerns a process for converting carbon dioxide into methane.

Latest Patents

Liu is credited with 1 patent: “Process to Treat a Carbon Dioxide Comprising Gas.” The invention describes contacting an aqueous solution containing dissolved carbon dioxide with an electron-charged packed bed under anaerobic conditions. The bed comprises a carrier, suitably activated carbon granules, and a biofilm of microorganisms. The process specifies that more than 90 mol% of the dissolved carbon dioxide is present as bicarbonate ions and/or carbonate ions.

Career Highlights

Liu is associated with Paqell B.V. Her listed patent reflects work on biological and electrochemical approaches to carbon dioxide conversion.

Collaborations

Liu’s listed coworker is Johannes Bernardus Maria Klok. The patent’s described process combines a charged packed bed and microorganisms to convert carbon dioxide into methane.

Conclusion

Dandan Liu’s patent highlights an approach to carbon dioxide conversion that uses an anaerobic microbial biofilm and a charged packed bed to produce methane.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…