Park Ridge, IL, United States of America

Dana Marie Exner

This inventor holds 8 USPTO granted patents and 1 published patent application. Top assignee: Kimberly-Clark Worldwide, Inc.. Active years: 2018-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dana Marie Exner. Retrieved from https://idiyas.com/inventor/dana-marie-exner

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 122(Granted Patents)


Company Filing History:


Years Active: 2018-2019

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8 patents (USPTO):Explore Patents

Title: Dana Marie Exner: Innovator in Packaging Solutions

Introduction

Dana Marie Exner is a prominent inventor based in Park Ridge, IL (US). She has made significant contributions to the field of packaging, holding a total of 8 patents. Her work is recognized for its innovation and practicality, particularly in the consumer goods sector.

Latest Patents

One of her latest patents is focused on a new type of package that enhances usability and efficiency. This innovation reflects her commitment to improving packaging solutions for everyday products.

Career Highlights

Dana is currently employed at Kimberly-Clark Worldwide, Inc., a leading company in the consumer goods industry. Her role there has allowed her to apply her inventive skills to develop products that meet the needs of consumers.

Collaborations

Throughout her career, Dana has collaborated with notable colleagues, including Thomas F. Borkovetz and Keith R. Haen. These partnerships have fostered a creative environment that encourages the development of innovative packaging solutions.

Conclusion

Dana Marie Exner is a trailblazer in the packaging industry, with a proven track record of innovation and collaboration. Her contributions continue to shape the future of packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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