Kitchener, Canada

Dan Williams

This inventor holds 1 USPTO granted patent. Top assignee: Sas IP, Inc.. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dan Williams. Retrieved from https://idiyas.com/inventor/dan-williams-z8at4qpj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Dan Williams - Innovator in Multi-Zonal Analysis

Introduction

Dan Williams is a notable inventor based in Kitchener, Canada. He has made significant contributions to the field of engineering through his innovative patent. His work focuses on the analysis of physical objects, particularly in multi-zonal contexts.

Latest Patents

Dan Williams holds a patent for "Systems and methods for multi-zonal analysis of physical objects." This patent describes a processor-implemented system designed for analyzing the physical behavior of multi-zonal objects. The system selects candidate multi-zonal engineering models, solution methods, and parameters associated with these models to analyze different zones of the physical object effectively. He has 1 patent to his name.

Career Highlights

Dan is currently employed at Sas IP, Inc., where he continues to develop and refine his innovative ideas. His work has positioned him as a key player in the field of engineering analysis.

Collaborations

Dan collaborates with talented individuals such as Davor Cokljat and Michael Engelman, contributing to a dynamic work environment that fosters innovation.

Conclusion

Dan Williams is a dedicated inventor whose work in multi-zonal analysis is paving the way for advancements in engineering. His contributions are valuable to the industry and highlight the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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