Company Filing History:
Years Active: 1998-1999
Title: Innovations by Dan Tulbure
Introduction
Dan Tulbure is an accomplished inventor based in Irvine, CA. He has made significant contributions to the field of packaging technology, particularly in the development of hermetic packaging solutions for silicon devices. With a total of 2 patents, Tulbure's work is recognized for its innovative approach to enhancing the reliability of electronic components.
Latest Patents
Tulbure's latest patents include a groundbreaking hermetic packaging technology for Schottky die. This technology utilizes a pressed ceramic frame, solid metal pads, a solid metal disc, metal seal rings, and a direct high-temperature solder bond to the die. Notably, there are no intermediate straps or wires used to connect the die to the metal pads, allowing the die to be an integral part of the final package. This design ensures that the device is hermetically sealed, making it suitable for high-reliability applications such as military or space programs. All materials used in this technology are carefully matched for coefficient of thermal expansion (CTE).
Another significant patent by Tulbure is a surface mount package designed for large area silicon devices. This package also employs a pressed ceramic frame and solid metal pads that are closely matched for CTE to each other and to the silicon die. Specifically designed for large area die greater than 0.0625 inches squared, this package facilitates high-temperature eutectic alloy bonding. The materials used in this package are CTE matched within 10%, ensuring optimal performance.
Career Highlights
Dan Tulbure is currently employed at Microsemi Corporation, where he continues to innovate in the field of packaging technology. His work has been instrumental in advancing the reliability and performance of electronic components.
Collaborations
Throughout his career, Tulbure has collaborated with notable colleagues, including Tracy A Autry and Fernando C Lynch. These collaborations have contributed to the successful development of his innovative technologies.
Conclusion
Dan Tulbure's contributions to packaging technology have significantly impacted the reliability of electronic devices. His innovative patents reflect a commitment to excellence and advancement in the field.