Microsemi Corporation

Dan Tulbure

Tracy A Autry

Fernando C Lynch

A hermetic packaging technology for silicon Schottky die or any other two terminal solderable die. The technology uses a pressed ceramic frame, solid metal pads, a solid metal disc, metal seal rings, and a direct high temperature solder bond to the die. There are no intermediate straps or wires used to connect the die to the metal pads. The die is actually part of the final package, or it can be said that the package is built around the die. The device is hermetically sealed for use in high reliability applications such as military or space programs. All materials used in the technology are matched for coefficient of thermal expansion (CTE).

Packaging technology for Schottky die

A surface mount package for use with large area silicon device. The package uses a pressed ceramic frame and solid metal pads which are closely matched for coefficient of thermal expansion (CTE) to each other and to the silicon die. The package is specifically designed for large area die (greater than 0.0625 inches squared) and for high temperature eutectic alloy bonding. All materials of the package are CTE matched to each other and to silicon within 10%.

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Irvine, CA, United States of America

Dan Tulbure