Tianjin, China

Dan Miao

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Microsoft Technology Licensing, LLC. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dan Miao. Retrieved from https://idiyas.com/inventor/dan-miao-yym5uj2p

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Innovations by Dan Miao in Depth Data Compression

Introduction

Dan Miao is an accomplished inventor based in Tianjin, China. He has made significant contributions to the field of depth data compression, showcasing his expertise through innovative techniques and arrangements.

Latest Patents

Dan Miao holds a patent for "Representation and compression of depth data." This patent describes techniques for layered compression of depth image data. The encoder in his invention partitions depth image data into a most significant bit (MSB) layer and a least significant bit (LSB) layer. It quantizes the MSB layer and generates quantization difference data based on this quantization. The encoder then applies the quantization difference data to the LSB layer to create an adjusted LSB layer.

Career Highlights

Dan Miao is currently associated with Microsoft Technology Licensing, LLC, where he continues to develop and refine his innovative ideas. His work has garnered attention for its potential applications in various technologies.

Collaborations

Dan has collaborated with notable colleagues, including Jingjing Fu and Yan Lu, who contribute to the dynamic environment of innovation at Microsoft.

Conclusion

Dan Miao's contributions to depth data compression exemplify the impact of innovative thinking in technology. His work continues to influence advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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