Edinburgh, United Kingdom

Dan Ghica

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Huawei Technologies Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dan Ghica. Retrieved from https://idiyas.com/inventor/dan-ghica

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Dan Ghica and His Patent in Program Compilation

Introduction

Dan Ghica is an inventor associated with Edinburgh, Great Britain. His patent work concerns a method and apparatus for compiling programs and deriving expressions.

Latest Patents

The provided information lists one patent for Dan Ghica: “Program Compilation Method and Apparatus.” The invention obtains two program expressions that depend on the same variable but use different operation types. It updates the variable’s operation type so that a differential operation produces no differential result or a zero result. The expressions are then processed separately to produce derivative function expressions, which are combined using the chain rule to generate the program’s compilation result.

Career Highlights

Ghica is associated with Huawei Technologies Co., Ltd. His listed patent reflects work at the intersection of program compilation, variable operations, and derivative computation. The supplied information does not specify his role or the patent’s filing or grant date.

Collaborations

The provided data names Le Tu and Mario Alvarez-Picallo as coworkers. It does not specify their roles in the patent or describe the nature of their collaboration.

Conclusion

Dan Ghica’s listed patent addresses a program-compilation approach that combines expression processing with the chain rule to produce derivative-based compilation results.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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