Dan Feng

Title: The Innovations of Dan Feng

Introduction

Dan Feng is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of electronics, particularly in the development of advanced materials for electronic applications. With a total of four patents to his name, Feng's work is recognized for its innovative approach and practical applications.

Latest Patents

Feng's latest patents include the development of coated copper particles and their use in electrically conductive adhesives. The coated copper particles are formed of copper cores that are surface coated with a composition comprising one or more conductive oxides. This innovation is crucial for enhancing the performance of electronic components. Additionally, he has patented solar cells that incorporate copper electrodes. These solar cells consist of semiconductor substrates with Cu electrodes derived from conductive pastes containing powder mixtures of Cu particles and crystalline Ge particles, along with glass frits dispersed in organic media.

Career Highlights

Dan Feng is currently employed at DuPont Electronics, Inc., where he continues to push the boundaries of electronic materials. His work has been instrumental in advancing technologies that are essential for modern electronics and renewable energy solutions.

Collaborations

Feng collaborates with notable colleagues, including Minfang Mu and Jose Manuel Rodriguez-Parada. Their combined expertise fosters an environment of innovation and creativity, leading to groundbreaking advancements in their field.

Conclusion

Dan Feng's contributions to the field of electronics through his patents and collaborations highlight his role as a leading inventor. His work not only enhances electronic materials but also supports the development of sustainable energy solutions.