The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10967428 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 06, 2021

Filed:

Aug. 28, 2015
Applicant:

Dupont Electronics, Inc., Wilmington, DE (US);

Inventors:

Minfang Mu, Shanghai, CN;

Dan Feng, Shanghai, CN;

Jose M. Rodriguez-Parada, Hockessin, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/02 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); B22F 1/00 (2006.01); C08K 9/02 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
B22F 1/02 (2013.01); B22F 1/0014 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); B22F 2301/10 (2013.01); B22F 2304/058 (2013.01); C08K 9/02 (2013.01); C08K 2003/2248 (2013.01); C08K 2201/001 (2013.01);
Abstract

Disclosed herein are coated copper particles formed of copper cores that are surface coated with a coating composition comprising one or more conductive oxides. Further disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) surface coated copper particles, and optional (c) solvent.


Find Patent Forward Citations

Mu, Minfang. (2021). Coated copper particles and use thereof (U.S. Patent No. 10967428). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10967428

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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