Braunschweig, Germany

Damien Devolder

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Sitech Stiztechnik Gmbh. Active years: 2016.


% Patents Active = 100.0

 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2016

Loading Chart...
Loading Chart...
1 patent (USPTO):Explore Patents

Title: Damien Devolder: Innovator in Head Restraint Technology

Introduction

Damien Devolder is a notable inventor based in Braunschweig, Germany. He has made significant contributions to the field of head restraint technology, showcasing his innovative spirit through his patented inventions.

Latest Patents

Devolder holds a patent for a "Head restraint with an autoreactive framework structure." This invention features a basic structure designed to adjust the head restraint and support a person's head. The design includes a holding structure and at least one framework structure, which consists of flexurally elastic flanks and deflectable cross struts. These elements work together to create a compensating, autoreactive deformation in response to force pulses, enhancing the safety and comfort of head restraints.

Career Highlights

Throughout his career, Damien Devolder has worked with various companies, including Sitech Sitztechnik GmbH. His experience in the industry has allowed him to develop and refine his innovative ideas, leading to the successful patenting of his head restraint technology.

Collaborations

Devolder has collaborated with professionals such as Jens Baumgarten and Martin Buchenberger. These partnerships have contributed to the development and implementation of his innovative designs.

Conclusion

Damien Devolder's work in head restraint technology exemplifies his commitment to innovation and safety. His patented invention reflects a significant advancement in the field, showcasing his expertise and dedication to improving user experience.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…