SHENZHEN, China

Dali Feng

This inventor holds 1 USPTO granted patent and 1 published patent application and 2 EPO patents. Top assignee: Shenzhen Smoore Technology Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dali Feng. Retrieved from https://idiyas.com/inventor/dali-feng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
Loading Chart...
1 patent (USPTO):Explore Patents

Title: Dali Feng - Innovator in Fiber Composite Materials

Introduction: Dali Feng is an inventor based in Shenzhen, China. He is currently associated with BYD Company Limited. Although he has not yet been granted any patents, his work focuses on innovative materials and methods that have the potential to impact various industries.

Latest Patent Applications: Dali Feng has submitted several patent applications that showcase his inventive capabilities. One of his latest applications is for a fiber composite material, which includes a heat resistant layer and a liquid guiding layer that are stacked. The heat resistant layer is made from a combination of heat resistant fibers, including polyimide fibers, and hydrophilic fibers, such as Tencel fibers. Another application involves a composite film, which includes a porous separator and a fiber layer containing polyetherimide, designed for use in lithium batteries.

Conclusion: Dali Feng is an emerging inventor whose work in fiber composite materials and innovative applications holds promise for future advancements. His contributions to the field may lead to significant developments in material science and technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…