This inventor holds 1 USPTO granted patent. Top assignee: Sgs-Thomson Microelectronics Limited. Active years: 1997.
Company Filing History:
Years Active: 1997
Title: The Innovative Contributions of Dale Thomas Moore
Introduction
Dale Thomas Moore is a notable inventor based in Plano, TX (US). She has made significant contributions to the field of integrated circuit packaging. Her innovative work has led to the development of a unique patent that enhances the functionality and efficiency of semiconductor devices.
Latest Patents
Dale Thomas Moore holds a patent for a "Detachable module/ball grid array package." This system is designed for packaging integrated circuit components, featuring a ball grid array substrate with a plurality of solder balls. The semiconductor device is mounted on the substrate and is electrically coupled to the solder balls. The design includes one or more terminals that connect to the substrate and the semiconductor device. Additionally, the detachable module can contain auxiliary components such as a data acquisition device, a wireless communications device, or output devices. The module is equipped with a body portion for housing the component and electrical connectors that mate with the terminals, ensuring both physical attachment and electrical connectivity.
Career Highlights
Dale has worked with Sgs-Thomson Microelectronics Limited, where she has been able to apply her expertise in semiconductor technology. Her innovative approach has contributed to advancements in the industry, particularly in the area of integrated circuit packaging.
Collaborations
Throughout her career, Dale has collaborated with notable colleagues, including Frank J Sigmund and Fred Chevreton. These partnerships have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.
Conclusion
Dale Thomas Moore's contributions to the field of integrated circuit packaging exemplify her innovative spirit and dedication to advancing technology. Her patent for the detachable module/ball grid array package showcases her ability to create solutions that enhance the functionality of semiconductor devices. Her work continues to influence the industry and inspire future innovations.