Itami, Japan

Daisuke Yamanaka

This inventor holds 3 USPTO granted patents. Top assignee: Sumitomo Electric Hardmetal Corp.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daisuke Yamanaka. Retrieved from https://idiyas.com/inventor/daisuke-yamanaka-d2eravwf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2025

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Daisuke Yamanaka: Innovator in Cutting Tool Technology

Introduction

Daisuke Yamanaka is a prominent inventor based in Itami, Japan. He has made significant contributions to the field of cutting tool technology, holding a total of 3 patents. His work is recognized for its innovation and practical applications in various industries.

Latest Patents

Among his latest patents, Daisuke has developed a cutting tool holder that enhances the efficiency and precision of machining processes. This invention reflects his commitment to advancing technology in the manufacturing sector.

Career Highlights

Daisuke Yamanaka is currently employed at Sumitomo Electric Hardmetal Corporation, a leading company in the production of cutting tools and materials. His role at the company allows him to apply his inventive skills to real-world challenges, contributing to the company's reputation for excellence.

Collaborations

Daisuke has collaborated with talented coworkers such as Shingo Hirota and Taiki Mugio. Their teamwork has fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.

Conclusion

Daisuke Yamanaka's contributions to cutting tool technology exemplify the spirit of innovation. His patents and collaborations continue to influence the industry, showcasing the importance of creativity in engineering and manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…