Moriyama, Japan

Daisuke Sato

This inventor holds 1 USPTO granted patent. Top assignee: Omron Corporation. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daisuke Sato. Retrieved from https://idiyas.com/inventor/daisuke-sato-ydzu4mzy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Daisuke Sato: Innovator in Adhesive Technology

Introduction

Daisuke Sato is a notable inventor based in Moriyama, Japan. He has made significant contributions to the field of adhesive technology, particularly through his innovative methods for curing adhesive compositions.

Latest Patents

Daisuke Sato holds a patent for a method for curing adhesive composition and a method for manufacturing bonded structures. This patent describes a process that involves arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend. The first adherend contains a light-to-heat conversion material that generates heat by absorbing the laser light. The curing process is achieved by irradiating the adhesive composition and the first adherend with laser light of the first wavelength.

Career Highlights

Daisuke Sato is associated with Omron Corporation, where he applies his expertise in adhesive technology. His work has led to advancements in manufacturing processes and product development.

Collaborations

Daisuke has collaborated with notable colleagues, including Takekazu Komori and Kyoji Kitamura. Their combined efforts contribute to the innovative projects at Omron Corporation.

Conclusion

Daisuke Sato's contributions to adhesive technology through his patented methods demonstrate his commitment to innovation in the field. His work continues to influence advancements in manufacturing and bonding techniques.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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