Yamaguchi, Japan

Daisuke Ozaki

This inventor holds 1 USPTO granted patent. Top assignee: Teijin Limited. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daisuke Ozaki. Retrieved from https://idiyas.com/inventor/daisuke-ozaki-9ykwhig2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Daisuke Ozaki: Innovator in Resin Composition

Introduction

Daisuke Ozaki is a notable inventor based in Yamaguchi, Japan. He has made significant contributions to the field of materials science, particularly in the development of resin compositions.

Latest Patents

Daisuke Ozaki holds a patent for a resin composition containing crystalline polyimide. This innovation showcases his expertise in creating advanced materials that can be utilized in various applications.

Career Highlights

Ozaki is currently employed at Teijin Limited, a leading company in the field of advanced materials and technology. His work at Teijin has allowed him to focus on innovative solutions that meet the demands of modern industries.

Collaborations

Throughout his career, Daisuke has collaborated with talented coworkers, including Kiyotsuna Toyohara and Toyoaki Ishiwata. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Daisuke Ozaki's contributions to resin composition and his work at Teijin Limited highlight his role as an influential inventor in the field of materials science. His innovative spirit continues to drive advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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