Company Filing History:
Years Active: 2025
Title: Daisuke Okuyama: A Patented Innovator in Lead Frame Technology
Introduction
Daisuke Okuyama, a talented inventor based in Tokyo, Japan, has made notable contributions to the field of semiconductor packaging technology. With a focus on innovative design and manufacturing methods, Okuyama holds a patent that reflects his commitment to enhancing electronic components.
Latest Patents
The patent in his portfolio is titled "Lead frame and manufacturing method thereof." This invention describes a lead frame that consists of multiple lead portions. A distinctive feature of this lead frame is that at least part of the upper surface and the sidewall surface of the lead portion exhibits a rough surface created through a specialized roughening treatment. Specifically, the patent details that the value of a* in the CIELab color space of the rough surface falls within a range from 12 to 19, while the value of b* ranges from 12 to 17. This innovation provides enhanced performance characteristics for electronic applications, ultimately contributing to improved manufacturing processes.
Career Highlights
Daisuke Okuyama is currently affiliated with Dai Nippon Printing Co., Ltd., a prominent company known for its advanced technology and solutions in various sectors. His work at this establishment has enabled him to develop critical innovations in the field of lead frame manufacturing and semiconductor technologies. Okuyama's expertise stands out for its practical application in electronic devices, contributing to the efficiency and reliability of such products.
Collaborations
Throughout his career, Okuyama has collaborated with several skilled professionals, including Masahiro Nagata and Kazuhiro Shinozaki. These partnerships have fostered a creative environment that encourages the sharing of ideas and technological advancements, allowing for further innovations in their respective fields.
Conclusion
Daisuke Okuyama exemplifies the inventive spirit that drives progress in technology, particularly in the realm of semiconductor packaging. With a significant patent to his name and ongoing contributions to Dai Nippon Printing Co., Ltd., Okuyama continues to influence the industry through his innovative approaches and collaborations. His work not only enhances current technologies but also paves the way for future developments in electronics.