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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12381136 B1

PDFFull Text
Date of Patent:
Aug. 05, 2025

Filed:

May. 30, 2024

Lead frame and manufacturing method thereof

Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Masahiro Nagata, Tokyo, JP;

Kazuhiro Shinozaki, Tokyo, JP;

Masahiro Yamada, Tokyo, JP;

Daisuke Okuyama, Tokyo, JP;

Chiaki Hatsuta, Tokyo, JP;

Kentarou Seki, Tokyo, JP;

Hideto Matsui, Tokyo, JP;

Kazunori Oouchi, Tokyo, JP;

Assignee:

DAI NIPPON PRINTING CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Jose R Diaz

Int. Cl.
CPC ...
H01L 23/495 (2006.01); C23C 18/22 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49582 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 23/495 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49517 (2013.01); H01L 23/49541 (2013.01); H01L 23/49579 (2013.01); C23C 18/22 (2013.01); H01L 23/3107 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73265 (2013.01); H05K 2203/0307 (2013.01);
Abstract

A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.

Find Patent Forward Citations

Nagata, Masahiro. (2025). Lead frame and manufacturing method thereof (U.S. Patent No. 12381136). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12381136

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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