This inventor holds 2 USPTO granted patents. Top assignee: Komatsu Ntc Ltd.. Active years: 2023-2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023-2024
Title: Daisuke Noda: Innovator in Three-Dimensional Shaping Technology
Introduction
Daisuke Noda is a prominent inventor based in Toyama, Japan. He has made significant contributions to the field of three-dimensional shaping technology. With a total of 2 patents to his name, Noda's work focuses on innovative methods and devices that enhance the shaping process of various materials.
Latest Patents
Noda's latest patents include a three-dimensional shaping device and a three-dimensional shaping method. The three-dimensional shaping device is equipped with a powder supply device that drops powder onto the surface of a workpiece, which can be a curved surface. Additionally, it features a laser light irradiation device that uses laser light as an energy beam to shape the deposited powder. This technology allows for the creation of beam structures on curved surfaces. His second patent also involves a three-dimensional shaping device that forms a layer of metal powder on a shaping object, utilizing a laser light with specific pulsed output characteristics. This method enables the shaping of bodies with narrower widths, showcasing Noda's innovative approach to three-dimensional shaping.
Career Highlights
Daisuke Noda is currently employed at Komatsu Ntc Ltd., where he continues to develop cutting-edge technologies in the field of three-dimensional shaping. His work has garnered attention for its potential applications in various industries, including manufacturing and design.
Collaborations
Noda has collaborated with notable coworkers, including Hidekazu Maehana and Tsunemoto Kuriyagawa. Their combined expertise contributes to the advancement of three-dimensional shaping technologies.
Conclusion
Daisuke Noda's contributions to three-dimensional shaping technology reflect his innovative spirit and dedication to advancing the field. His patents demonstrate a commitment to enhancing shaping methods and devices, paving the way for future developments in this area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile