Chiryu, Japan

Daisuke Nakamura

This inventor holds 3 USPTO granted patents and 1 EPO patent. Top assignee: Fuji Corporation. Active years: 2018-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daisuke Nakamura. Retrieved from https://idiyas.com/inventor/daisuke-nakamura-sxtq24ab

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 2.3

ph-index = 1


Company Filing History:


Years Active: 2018-2020

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3 patents (USPTO):Explore Patents

Title: Daisuke Nakamura: Innovator in Automatic Splicing Technology

Introduction

Daisuke Nakamura is a prominent inventor based in Chiryu, Japan. He has made significant contributions to the field of automatic splicing devices, holding a total of 3 patents. His work is characterized by innovative solutions that enhance the efficiency of component mounting processes.

Latest Patents

One of Daisuke Nakamura's latest patents is an automatic splicing device designed to improve communication with component mounters or host computers. This device features a communication device that enables seamless interaction with connected systems. Additionally, it includes a connection control device that manages the connection between the first and second tapes. A display device is also incorporated to provide relevant information regarding the splicing process.

Career Highlights

Daisuke Nakamura is currently employed at Fuji Corporation, where he continues to develop cutting-edge technologies. His expertise in automatic splicing devices has positioned him as a key player in the industry. His innovative approach has led to advancements that streamline manufacturing processes.

Collaborations

Daisuke collaborates with talented coworkers, including Masato Shibuya and Satoshi Osaki. Their combined efforts contribute to the ongoing success and innovation at Fuji Corporation.

Conclusion

Daisuke Nakamura's work in automatic splicing technology exemplifies his commitment to innovation and efficiency. His patents reflect a deep understanding of the needs within the manufacturing sector. Through his contributions, he continues to shape the future of component mounting technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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