Daisuke Mori

Title: Daisuke Mori: Innovator in Electronic Component Technology

Introduction

Daisuke Mori is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of electronic components, particularly through his innovative patent work. His expertise and dedication to advancing technology have positioned him as a key figure in his industry.

Latest Patents

Daisuke Mori holds a patent for a multi-layer sheet for mold underfill encapsulation, which includes a method for mold underfill encapsulation, an electronic component mounting substrate, and a production method for electronic components. The primary problem addressed by this invention is the need for a multi-layer sheet that exhibits good infiltrability between electrodes. To solve this issue, Mori's invention features an outermost layer characterized by a resin composition that has a local maximum loss tangent (tan δ) value of 3 or more at a measurement temperature of 125° C. for a measurement time of 0-100 seconds.

Career Highlights

Mori is currently employed at Nagase Chemtex Corporation, where he continues to develop innovative solutions in the field of electronic components. His work has garnered attention for its practical applications and potential to enhance the performance of electronic devices.

Collaborations

Mori collaborates with talented colleagues, including Masahiro Asahara and Katsushi Kan, who contribute to the innovative environment at Nagase Chemtex Corporation. Their combined expertise fosters a culture of creativity and advancement in technology.

Conclusion

Daisuke Mori's contributions to electronic component technology through his innovative patents highlight his role as a leading inventor in the field. His work not only addresses critical challenges but also paves the way for future advancements in electronic components.