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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12362310 B1

PDFFull Text
Date of Patent:
Jul. 15, 2025

Filed:

Aug. 03, 2020

Multi-layer sheet for mold underfill encapsulation, method for mold underfill encapsulation, electronic component mounting substrate, and production method for electronic component

Applicant:

Nagase Chemtex Corporation, Osaka, JP;

Inventors:

Daisuke Mori, Hyogo, JP;

Masahiro Asahara, Hyogo, JP;

Katsushi Kan, Hyogo, JP;

Eiichi Nomura, Hyogo, JP;

Assignee:

NAGASE CHEMTEX CORPORATION, Osaka, JP;

Attorneys:

Imaizumi IP Law, PLLC

KAZUNAO KUBOTERA

TOSHIKATSU IMAIZUMI

Primary Examiner:

Mouloucoulaye Inoussa

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 21/566 (2013.01); H01L 23/295 (2013.01); H01L 23/3135 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1713 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29019 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29541 (2013.01); H01L 2224/29553 (2013.01); H01L 2224/29562 (2013.01); H01L 2224/2957 (2013.01); H01L 2224/2999 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83204 (2013.01); H01L 2924/3511 (2013.01);
Abstract

[Problem] To provide a multi-layer sheet for mold underfill encapsulation, which exhibits good infiltrability between electrodes. [Solution] In order to solve the aforementioned problem, the present invention provides a multi-layer sheet for mold underfill encapsulation, which is characterized by having provided as an outermost layer thereof an (A) layer that comprises a resin composition having a local maximum loss tangent (tan δ) value of 3 or more at a measurement temperature of 125° C. for a measurement time of 0-100 seconds.

Find Patent Forward Citations

Mori, Daisuke. (2025). Multi-layer sheet for mold underfill encapsulation, method for mold underfill encapsulation, electronic component mounting substrate, and production method for electronic component (U.S. Patent No. 12362310). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12362310

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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