Toyota, Japan

Daisuke Horiuchi

This inventor holds 1 USPTO granted patent. Top assignee: Creative Technology Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daisuke Horiuchi. Retrieved from https://idiyas.com/inventor/daisuke-horiuchi-t1psvz3t

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Daisuke Horiuchi and an Electric Precipitator for Press Molds.

Introduction

Daisuke Horiuchi is an inventor associated with Toyota, Japan, and Creative Technology Corporation. His work includes an invention designed to collect dusty foreign matter generated during stamping.

Latest Patents

Horiuchi is credited with 1 patent: “Electric Precipitator for Press Mold and Press Mold Using Same.” The invention uses electrostatic force to collect dust during stamping. Its laminated sheet combines a dust-collection layer, two electrode layers, insulation layers, and a fixation layer for attachment to a mold. A power supply applies voltage across the electrodes. The design aims to improve collection reliability and installation while supporting safe use. The patent also describes a press mold incorporating the precipitator.

Career Highlights

Horiuchi’s listed patent reflects work on integrating dust collection directly with press-mold equipment. The invention’s layered construction is intended to capture airborne debris while insulating the electrodes from one another and from the mold.

Collaborations

Horiuchi’s listed coworkers include Takaaki Hasegawa and Hiroyuki Moriyama. The patent is associated with Creative Technology Corporation.

Conclusion

Daisuke Horiuchi’s patent presents an electrostatic dust-collection system designed for press molds, combining a layered precipitator with a mold-ready fixation structure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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