Daisuke Akita

Title: Daisuke Akita: Innovator in Grinding Technologies

Introduction

Daisuke Akita is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of grinding technologies, holding a total of three patents. His innovative methods have advanced the efficiency and effectiveness of grinding processes in various applications.

Latest Patents

One of Akita's latest patents is a grinding method of workpiece. This method includes a first grinding step that executes grinding feed of a rough grinding unit while supplying grinding water in a specific amount to suppress wear of grinding abrasive stones. The second grinding step promotes dressing of the grinding abrasive stones to prepare for processing the next workpiece. This step involves grinding the workpiece to the finished thickness while adjusting the grinding water amount to enhance self-sharpening of the stones. Another notable patent is a hard wafer grinding method. This method involves a rough grinding step that forms a centrally recessed shape in a hard wafer, followed by a finish grinding step that expands the ground area from the peripheral part to the central part, ensuring the wafer achieves a predetermined thickness.

Career Highlights

Daisuke Akita has worked with notable companies such as Disco Corporation and Yamatake Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in grinding technologies.

Collaborations

Throughout his career, Akita has collaborated with talented individuals, including Makoto Saito and Tomoshige Yamamoto. These collaborations have fostered innovation and the development of new techniques in the field.

Conclusion

Daisuke Akita's contributions to grinding technologies through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, showcasing the importance of innovation in engineering.