Fukushima, Japan

Dai Sasaki

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Panasonic Intellectual Property Management Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dai Sasaki. Retrieved from https://idiyas.com/inventor/dai-sasaki-mavbs6qm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2023

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Dai Sasaki - Innovator in Metal-Clad Laminate Technology

Introduction

Dai Sasaki is a notable inventor based in Fukushima, Japan. He has made significant contributions to the field of materials science, particularly in the development of metal-clad laminates. His innovative work has led to the creation of a patented technology that enhances the performance of printed wiring boards.

Latest Patents

Dai Sasaki holds a patent for a metal-clad laminate and printed wiring board. This invention includes an insulating layer and a metal layer stacked on the insulating layer. The insulating layer consists of a first layer and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition that includes composite particles. These composite particles have a core made of fluororesin and a shell of silicon oxide that partially coats the core. The second layer contains a cured product of a second resin composition, which may or may not include composite particles. When the second resin composition does contain composite particles, the ratio of these particles to the solid content is lower than that in the first resin composition.

Career Highlights

Dai Sasaki is associated with Panasonic Intellectual Property Management Co., Ltd., where he has been instrumental in advancing the company's technological capabilities. His work in developing innovative materials has positioned him as a key figure in the field of electrical engineering and materials science.

Collaborations

Throughout his career, Dai has collaborated with talented individuals such as Yasunori Nishiguchi and Kazuki Matsumura. These collaborations have fostered a creative environment that has led to the successful development of new technologies.

Conclusion

Dai Sasaki's contributions to the field of metal-clad laminates exemplify the importance of innovation in technology. His patented work not only enhances the functionality of printed wiring boards but also showcases the potential for future advancements in materials science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…