Daejeon, South Korea

Dai Heon Lee

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2023.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:

goldMedal1 out of 834,350 
Other
 patents

Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations of Dai Heon Lee

Introduction

Dai Heon Lee is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of adhesive technology. His work focuses on developing innovative adhesive compositions that are both effective and environmentally friendly.

Latest Patents

Dai Heon Lee holds a patent for an adhesive composition, which includes a polyvinyl alcohol and a water-soluble polyphenol compound. This invention is particularly noteworthy as it relates to an adhesive that exhibits low toxicity and can adhere without the need for a curing process, unlike conventional adhesives. The adhesive composition also allows for the creation of a gel through hydrogen bonding between the polyvinyl alcohol and the water-soluble polyphenol compound, while maintaining its adhesive properties even in water. He has 1 patent to his name.

Career Highlights

Throughout his career, Dai Heon Lee has demonstrated a commitment to innovation in adhesive technology. His research has led to advancements that not only improve the performance of adhesives but also address safety and environmental concerns.

Collaborations

Dai Heon Lee has worked alongside talented colleagues, including Du Hwan Kim and Jung Seok Hahn. Their collaborative efforts have contributed to the success of his innovative projects.

Conclusion

Dai Heon Lee's contributions to adhesive technology highlight his role as a forward-thinking inventor. His patented innovations pave the way for safer and more effective adhesive solutions in various applications.

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