Beijing, China

Dai Bin

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dai Bin. Retrieved from https://idiyas.com/inventor/dai-bin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Dai Bin

Introduction

Dai Bin is a notable inventor based in Beijing, China. He has made significant contributions to the field of telecommunications through his innovative patent. His work focuses on improving the efficiency of dialing methods for calling parties.

Latest Patents

Dai Bin holds a patent for a "Dialing method and device." This invention allows a calling party to determine multiple phone number groups to be dialed in either a simultaneous or sequential ringing mode. Each group includes at least one phone number, and the method transmits these groups along with a dialing flag to a calling server. The dialing flag indicates whether the numbers should be rung simultaneously or sequentially. This innovation enables users to customize multiple phone numbers without the need for prior registration in the calling server, thus avoiding the hassle of maintaining a large-scale database.

Career Highlights

Dai Bin is currently employed at International Business Machines Corporation, commonly known as IBM. His role at IBM allows him to further develop his innovative ideas and contribute to advancements in technology.

Collaborations

Some of his coworkers include Yang Lei and Chen Y Yu, who collaborate with him on various projects within the company.

Conclusion

Dai Bin's contributions to the field of telecommunications through his innovative dialing method demonstrate his commitment to enhancing user experience and efficiency. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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