This inventor holds 1 USPTO granted patent and 5 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Dahye Lee - Innovator in Semiconductor Packaging
Introduction
Dahye Lee is a prominent inventor based in Anyang-si, South Korea. She has made significant contributions to the field of semiconductor packaging, showcasing her expertise and innovative spirit. With a focus on enhancing the efficiency and functionality of semiconductor devices, her work has garnered attention in the industry.
Latest Patents
Dahye Lee holds a patent for a semiconductor package that includes a package substrate and a first stack structure. This first stack structure consists of first semiconductor chips that are stacked and interconnected by bonding wires. Additionally, a second stack structure is positioned on top of the first stack structure, featuring second semiconductor chips with an overhang region that extends beyond the uppermost first semiconductor chip. The design incorporates an adhesive member that secures the second stack structure to the first, along with an encapsulant that covers both stack structures. Notably, some bonding wires are embedded in the die adhesive film within the overhang region, providing support for the second stack structure. This innovative design enhances the overall performance and reliability of semiconductor packages.
Career Highlights
Dahye Lee is currently employed at Samsung Electronics Ltd., a leading global technology company. Her role at Samsung has allowed her to work on cutting-edge technologies and contribute to advancements in semiconductor packaging. Her dedication to innovation and excellence has positioned her as a valuable asset to her team and the company.
Collaborations
Dahye collaborates with talented colleagues, including Hyunseok Kim and Wanho Park. These partnerships foster a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Dahye Lee's contributions to semiconductor packaging exemplify her innovative mindset and commitment to advancing technology. Her patent and work at Samsung Electronics Ltd. highlight her role as a key player in the industry. Through her collaborations and dedication, she continues to push the boundaries of what is possible in semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile