Yongin-si, South Korea

Daeyeong Lee


Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: **Innovator Spotlight: Daeyeong Lee of Samsung Electronics**

Introduction

Daeyeong Lee, an accomplished inventor based in Yongin-si, South Korea, has made significant contributions to the field of thermal management in computing technology. With a patent to his name, he is recognized for developing innovative solutions that enhance processor efficiency.

Latest Patents

Daeyeong Lee's notable patent is titled "Apparatus and method for dynamic thermal management using frequency clamping and idle injection." This invention discloses an apparatus designed for dynamic thermal management, incorporating a thermal management unit that evaluates the need for thermal intervention based on temperature readings from multiple sensors within the processor. The unit generates an indication signal that aids a controller in efficiently managing the processor's thermal conditions. The controller employs various methods to optimize performance, including adjusting states of processor cores, operating voltage levels, and clock signal frequencies.

Career Highlights

Currently, Daeyeong Lee is employed at Samsung Electronics Co., Ltd., where he has been pivotal in driving innovations that support the company's technological advancements. His expertise in thermal management has played a significant role in enhancing the reliability and performance of processors.

Collaborations

Throughout his career, Daeyeong Lee has collaborated with talented colleagues, including Jong-Lae Park and Bumgyu Park. Together, they contribute to research and development efforts, aiming to push the boundaries of technology in the electronics sector.

Conclusion

Daeyeong Lee's inventive work highlights the importance of innovation in addressing complex challenges in technology. Through his patent and collaborations, he continues to impact the field positively, demonstrating the value of dynamic thermal management systems in modern processors.

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