Osan, South Korea

Daewook Kim

This inventor holds 1 USPTO granted patent. Top assignees: New Power Plasma., Ltd., Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daewook Kim. Retrieved from https://idiyas.com/inventor/daewook-kim-63rlovzv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Daewook Kim and Plasma Surface Treatment Technology

Introduction

Daewook Kim is an inventor associated with Osan, South Korea. His work includes an invention for plasma surface treatment designed to support semiconductor-device manufacturing while protecting delicate components. The supplied information lists 1 patent.

Latest Patents

Kim’s listed patent is titled “Apparatus for Conducting Plasma Surface Treatment, Board Treatment System Having the Same, and Method of Manufacturing Semiconductor Devices Using the Same.” It describes a surface-treatment apparatus with a process chamber and an external plasma generator connected to the chamber by a supply duct. A heat exchanger cools the process radicals as they pass through the duct, while a flow controller directs their movement and discharge.

The invention is intended to treat package structures with narrow mounting gaps while avoiding damage to integrated-circuit chips and boards. This approach addresses the need for controlled surface processing in semiconductor-device manufacturing.

Career Highlights

The supplied career information associates Kim with Samsung Electronics and New Power Plasma. His listed patent focuses on plasma-based surface treatment and semiconductor manufacturing.

Collaborations

Junyoung Oh and Jaeho Kwak are identified as Kim’s coworkers. The supplied information does not specify their roles in the patent or the invention.

Conclusion

Daewook Kim’s listed invention applies controlled plasma radicals to semiconductor package treatment, with cooling and flow-control features intended to protect sensitive components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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