Daeha Joung

Title: Daeha Joung and a Printable Conductive Silicone Ink.

Introduction

Daeha Joung is an inventor associated with Virginia Commonwealth University in Richmond, Virginia. His patent work focuses on a carbon-particle silicone ink designed for 3D printing and flexible sensing applications. The available information lists 1 patent for him.

Latest Patents

Joung’s patent, “3D-Printable One-Part Carbon Particle Elastomer Ink for Applications Such as Health Monitoring,” describes a printable ink made from one-part room-temperature-vulcanized silicone and conductive carbon particles, including carbon nanotubes. Butyl acetate may be used to disperse the nanotubes in the silicone precursor.

Because the ink is a one-part formulation, it can be printed without prior mixing and cures under ambient conditions. It can be dispensed at approximately 100-micrometer resolution on both polar and nonpolar substrates, and can form self-supporting, high-aspect-ratio structures without sacrificial layers. The resulting composite is designed to respond sensitively and reproducibly to tensile and compressive stimuli.

The patent also describes the composite’s electrical and thermal conductivity, which may support flexible, stretchable heating elements. Potential applications include body-temperature regulation, water distillation, and devices that combine temperature sensing with Joule heating.

Career Highlights

Joung’s listed patent reflects work at the intersection of additive manufacturing, elastomer materials, and conductive composites. The ink’s one-part design and ability to form complex structures are intended to support practical fabrication of flexible sensors and other functional components.

Collaborations

The provided information names Andy Shar and Philip Glass as Joung’s coworkers. It does not specify their roles in the patent or the extent of their collaboration.

Conclusion

Daeha Joung’s patent presents a versatile 3D-printable silicone ink that combines conductive carbon particles with ambient curing, flexible sensing, and heating capabilities.