Pyoungtaek-si, South Korea

Dae-Wook Yang


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2009-2010

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Dae-Wook Yang: Innovator in Integrated Circuit Technology

Introduction

Dae-Wook Yang is a prominent inventor based in Pyoungtaek-si, South Korea. He has made significant contributions to the field of integrated circuit technology, holding a total of 2 patents. His innovative work has paved the way for advancements in electronic packaging systems.

Latest Patents

Dae-Wook Yang's latest patents include an integrated circuit underfill package system. This system involves providing a substrate with a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted. This innovative approach enhances the reliability and performance of integrated circuits.

Career Highlights

Dae-Wook Yang is currently employed at Stats Chippac Pte. Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise in integrated circuit packaging has been instrumental in the company's success.

Collaborations

Throughout his career, Dae-Wook Yang has collaborated with talented professionals, including Hyung Jun Jeon and Ki Youn Jang. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Dae-Wook Yang's contributions to integrated circuit technology exemplify his dedication to innovation. His patents and work at Stats Chippac Pte. Ltd. highlight his role as a key player in advancing electronic packaging systems.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…