DaAe Lee

Title: DaAe Lee - Innovator in Semiconductor Technology

Introduction

DaAe Lee is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

DaAe Lee holds a patent for a semiconductor device and method of making an interconnect bridge with integrated passive devices. This invention involves a semiconductor device that features a first substrate, with both a first semiconductor die and a second semiconductor die positioned over it. An interconnect bridge is placed over these semiconductor dies, which includes a second substrate. A conductive trace is formed over this second substrate, establishing an electrical connection between the first and second semiconductor dies. Additionally, an integrated passive device (IPD) is formed over the second substrate, further enhancing the functionality of the semiconductor device. An encapsulant is then deposited over the first substrate, first semiconductor die, second semiconductor die, and interconnect bridge, ensuring the integrity and performance of the device.

Career Highlights

DaAe Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to advance his work in semiconductor technology. His innovative approach and dedication to research have positioned him as a key figure in his field.

Collaborations

Throughout his career, DaAe Lee has collaborated with notable colleagues, including YongTaek Lee and JaeMyeong Kim. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

DaAe Lee's contributions to semiconductor technology through his patent and work at Stats Chippac Pte. Ltd. highlight his role as an influential inventor in the industry. His innovative spirit and collaborative efforts continue to drive advancements in this critical field.