Da Yuan Shih

Title: Da Yuan Shih: Innovator in Thermal Interface Technology

Introduction

Da Yuan Shih is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of thermal interface technology, holding 2 patents that enhance the efficiency of heat dissipation in electronic devices. His work is particularly relevant in today's technology-driven world, where effective thermal management is crucial for device performance.

Latest Patents

One of Da Yuan Shih's latest patents is a patterned metal thermal interface. This invention involves a system designed to dissipate heat from heat-generating devices. In one embodiment, the system includes a heat sink with a surface adapted for thermal coupling to a heat-generating device. The thermal interface features at least one patterned surface, allowing it to thermally couple the heat sink to the device effectively. The unique patterned surface enables the thermal interface to deform under compression, improving conformity to the surfaces of both the heat sink and the heat-generating device. This innovation leads to enhanced thermal performance and reliability.

Career Highlights

Da Yuan Shih is associated with the International Business Machines Corporation (IBM), where he has been instrumental in developing advanced thermal management solutions. His expertise in this area has positioned him as a key contributor to the company's research and development efforts.

Collaborations

Da Yuan Shih has collaborated with several talented individuals, including Bruce Kenneth Furman and Sushumna Iruvanti. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Da Yuan Shih's contributions to thermal interface technology exemplify the importance of innovation in enhancing electronic device performance. His patents reflect a commitment to improving thermal management solutions, making a significant impact in the field.