Company Filing History:
Years Active: 1994-2003
Title: Innovations by Curtis L Miller
Introduction
Curtis L Miller is a notable inventor based in Vestal, NY (US). He has made significant contributions to the field of circuitization, holding a total of 4 patents. His work primarily focuses on enhancing the efficiency and density of printed wiring boards.
Latest Patents
One of his latest patents is titled "Fine pitch circuitization with filled plated through holes." This invention describes a method for preparing high-density printed wiring boards by applying a solid material into plated through holes. This technique ensures that the metallized layers within the through hole remain unaffected by chemical metal etchants, allowing for the reduction of lateral surface metallized layers. The result is fine pitch circuitry ranging from 25 to 40 microns, which provides excellent electrical connections between fine line circuitry. Various embodiments of printed wiring boards are also presented in this patent.
Another significant patent by Miller is "Fine pitch circuitization with unfilled plated through holes." This method involves creating a circuitized substrate with plated through holes that are free of filler material. The process includes forming a dielectric substrate with via holes, applying conductive layers, and using photoresist to create a desired circuit pattern. The end result is a circuitized substrate with plated through holes that extend from the upper face to the lower face of the substrate.
Career Highlights
Curtis L Miller is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to innovate and develop advanced technologies in the field of circuitization.
Collaborations
Miller has collaborated with notable coworkers such as Thomas R Miller and Michael Wozniak, contributing to various projects and innovations within the company.
Conclusion
Curtis L Miller's contributions to the field of circuitization through his patents and work at IBM highlight his role as a significant inventor in the technology sector. His innovative methods continue to influence the development of high-density printed wiring boards.