Denver, CO, United States of America

Curtis L Huetson


Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 1986-1990

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2 patents (USPTO):Explore Patents

Title: Curtis L. Huetson: Innovator in Electrical Component Adaptation

Introduction

Curtis L. Huetson is a notable inventor based in Denver, CO, recognized for his contributions to the field of electrical engineering. He holds 2 patents that showcase his innovative approach to interfacing electrical components with printed circuit boards. His work has significantly impacted the efficiency of electronic assembly processes.

Latest Patents

One of Huetson's latest patents is an "Adaptor for Surface Mount and Through-Hole Components." This adaptor allows for the seamless integration of both surface mount and through-hole electrical components to a printed circuit board. It is designed to accommodate high-volume assembly techniques, such as wave soldering and machine insertion, enhancing the manufacturing process. Another significant patent is the "Apparatus for Preheating Printed Circuit Boards." This device ensures that printed circuit boards are uniformly preheated before the soldering of discrete electronic components, preventing warping due to rapid temperature changes during the soldering process.

Career Highlights

Throughout his career, Huetson has worked with prominent companies, including American Telephone and Telegraph Co. and AT&T Information Systems Inc. His experience in these organizations has contributed to his expertise in electrical engineering and innovation.

Collaborations

Huetson has collaborated with various professionals in the field, including his coworker John R. Hayden. Their joint efforts have likely fostered advancements in the technologies they developed.

Conclusion

Curtis L. Huetson's innovative patents and career achievements highlight his significant contributions to electrical engineering. His work continues to influence the efficiency of electronic component assembly and preheating processes.

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