American Telephone and Telegraph, Co.

At&t Technologies, Inc.

At&t Information Systems Inc.

Curtis L Huetson

John R Hayden

An adaptor for interfacing a surface mount or through-hole electrical component to a printed circuit board. In one orientation of the adaptor relative to the printed circuit board, the adaptor receives a through-hole component and interfaces this component to a printed circuit board position designed for a surface mount component. In another orientation of the adaptor relative to the printed circuit board, the adaptor receives a surface mount component and interfaces this component to a printed circuit board position designed for a through-hole component. Advantageously, the adaptor is compatible with high-volume assembly techniques, such as wave soldering and machine insertion.

Adaptor for surface mount and through-hole components

A heating device is disclosed wherein a printed circuit board is uniformly preheated before discrete electronic components are soldered onto the boards. The soldering process includes a reflow stage where the boards are subject to rapid temperature change causing internal heat stresses which warp the boards if they haven't been preheated. The device comprises a non-conductive body and conductive elements, such as steel staples, embedded in said body. The staples extend through both sides of said body making contact with a heating surface and supporting the printed circuit board which sits upon them. The staples are spaced and arranged so the components' electrical pins which extend beyond the bottom surface of the board pass into the bed of staples without interference. Therefore, heat is transferred from the heating surface directly to the board via the conducting staples in a uniform fashion.

Growing community of inventors

Denver, CO, United States of America

Curtis L Huetson