Curtis H Kempton

Title: Innovations of Curtis H Kempton

Introduction

Curtis H Kempton is a notable inventor based in Mesa, AZ (US). He has made significant contributions to the field of multichip module substrates, showcasing his expertise through his innovative patent.

Latest Patents

Curtis H Kempton holds a patent for a "Method of manufacture multichip module substrate." This invention involves an additive process that utilizes multiple layers of a fluoropolymer composite material and copper. The process includes plating copper layers and laminating fluoropolymer composite layers. A unique seeding process enhances the bonding reliability between the fluoropolymer composite material and the plated copper. This innovation eliminates the need for a barrier metal layer between insulation and conductors, allowing for multiple metal and dielectric layers within a single structure. The design incorporates lead lines in separate mutually orthogonal planes, along with solid copper vias for electrical interconnection and thermal management.

Career Highlights

Curtis H Kempton is associated with Rogers Corporation, where he continues to develop and refine his innovative ideas. His work has contributed to advancements in the manufacturing processes of multichip module substrates.

Collaborations

Throughout his career, Curtis has collaborated with notable colleagues, including W David Smith and John A Olenick. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Curtis H Kempton's contributions to the field of multichip module substrates exemplify his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in manufacturing processes, showcasing the potential for future developments in this area.