Company Filing History:
Years Active: 2025
Title: Innovations by Cuina Wang
Introduction
Cuina Wang is a notable inventor based in Tianjin, China. He has made significant contributions to the field of integrated circuit design, holding a total of 3 patents. His work focuses on innovative methods and systems that enhance the efficiency and functionality of electronic devices.
Latest Patents
One of Cuina Wang's latest patents is a "Method, system, medium and program for clock design of physical partition structure." This invention presents a clock design method for two or more physical partition structures based on a common system clock. The method involves determining the distance of each circuit logic from the system clock and obtaining multiple clock nodes to create varying delays based on this distance. This innovative approach allows for improved timing convergence of circuit logic.
Another significant patent is the "Method, system, apparatus, medium, and program for physical design wiring and optimization." This integrated circuit physical design method includes a two-step wiring process. In the first step, physical design wiring is performed with different weights assigned to signal lines and clock lines. The second step involves reperforming the wiring on any violation signal lines, ensuring that the design meets timing requirements.
Career Highlights
Cuina Wang is currently employed at Phytium Technology Co., Ltd., where he continues to develop cutting-edge technologies in the field of integrated circuits. His expertise in physical design and optimization has positioned him as a valuable asset to his company.
Collaborations
Cuina Wang collaborates with talented colleagues, including Xiaokun Luan and Yongfeng Sun. Their combined efforts contribute to the advancement of innovative solutions in technology.
Conclusion
Cuina Wang's contributions to integrated circuit design through his patents demonstrate his commitment to innovation and excellence in technology. His work continues to influence the field and pave the way for future advancements.