Cui Huo

Title: Innovations of Cui Huo in Circuit Materials

Introduction

Cui Huo is an accomplished inventor based in Guangdong, China. He has made significant contributions to the field of circuit materials, showcasing his expertise through innovative patents. His work focuses on enhancing the performance and reliability of circuit boards.

Latest Patents

Cui Huo holds a patent for a circuit material and a circuit board containing the same. The patent describes a circuit material that comprises a conductive metal layer and a dielectric substrate layer, with an adhesive layer arranged between them. This adhesive layer is made from a composition that includes a resin component, which consists of unsaturated polyphenylene ether resin, SBS resin, and maleimide resin. The non-resin component includes an initiator. The adhesive layer is created by applying the adhesive composition, dissolved in a solvent, onto the surface of the conductive metal layer or the dielectric substrate layer, or by applying it to a release material and removing the release material after partial or complete curing.

Career Highlights

Cui Huo is currently employed at Shengyi Technology Co., Ltd., where he continues to develop innovative solutions in circuit technology. His work has been instrumental in advancing the capabilities of circuit materials, making them more efficient and effective for various applications.

Collaborations

Cui Huo collaborates with talented individuals such as Weifeng Yin and Rui Liu, who contribute to his projects and enhance the innovation process within the company.

Conclusion

Cui Huo's contributions to circuit materials through his patent demonstrate his commitment to innovation in technology. His work at Shengyi Technology Co., Ltd. continues to influence the industry positively.